Photoelectric Sensors

Ultra-small size ratio ※about 50% reduction ※Compared with EX-10 series

The ultra-thin 3mm case is realized by a new semiconductor packaging technology with leadless solder mounting. Even in the narrow space where only the fiber-optic head can be installed in the past, it can be easily loaded. At the same time, the built-in amplifier saves space by eliminating the need for an additional amplifier.